Basic Process:
The said product is a close-cell, conductive soft foam. It is produced by compounding the PE resin with conductive fillers & blowing agents to extrude certain sheets, then cross-linking and foaming. Sheet being molded, the conductive filler forms conductive channel/ network internally, so as to achieve the purpose of static discharge.
Technical Index:
序号 NO
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项 目/Items
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指 标/ data
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CE系列(导电型)
CE Series(conductive)
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DE系列(耗散型)
DS Series(Dissipative)
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1
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颜色/ Color
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黑色/Black
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2
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密度/Density
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30-80KG/m3
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3
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表面电阻/surface Resistivity
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103-6 Ω/sq
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106-9 Ω/sq
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4
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体积电阻/Volume Resistivity
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103-6 Ω/sq
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106-9 Ω/sq
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5
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摩擦静电压/Abrasive Potential
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<50V
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<100V
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6
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静电压衰减时间/Attenuation Half-time
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<1.0s
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Characteristics:
1.Excellent ESD effect because its interior conductive lattice;
2.Able to discharge electrostatic rapidly and independent to environmental humidity
3.Permanent ESD effect, Not affected by ambient humidity;
4.Excellent conductive effect: resistivity value 103—109 Ω/sq;
5.Superior buffering and cushioning performance: independent and meticulous closed cell;
6.High temperature resistance: EPE,IXPE resists a maximum temperature of 120°C
7.Chemical corrosion-resistant: resistant to organic solvents, acids, alkalis, etc;
8.Non-chemical corrosion: free chemical corrosion to the electronic devices and the packing materials;
9.Heat insulation, sound insulation, non-absorbent, moisture-proof;
10.Satisfactory performance of secondary processing, easy to shape.
Use and applications:
1.The use of the aforementioned components, boards, modules packages, electronics, telecommunications industry:
2.Applications in aviation, aerospace, communications, military ordnance and chemical industry.
3.Advantage: compared with traditional hollow board, conductive IXPE foam board is not only flexible and buffering, but also non-traumatic to electric devices and hands, while traditional hollow board is very easy to scratch electronic devices and hand in the process of use. The most important thing is that IXPE foam’s life is as several times longer as hollow boards;Compounded with anti-static, buffering and circulating properties, conductive IXPE foam trays for Hard Disks, Cell phones, Motherboards and Memory Bar have irreplaceable advantages to the traditional injection molding trays, which make sure the maximum protection to those devices when circulating.
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